온도편차 최소화를 위한 사출금형 냉각회로의 최적설계

The injection molded part quality is affected much by the mold cooling so that it is necessary to optimize the mold cooling circuit in the part design step prior to the mold design step. Optimization of the mold cooling circuit has been proposed previously in various ways. In this work, optimization of the mold cooling circuit was automated by a commercial PIDO (Process Integration and Design Optimization) tool, PIAnO for a large automotive part such as bumpers and instrument panels. The cooling channels and baffle tubes were located on the offset profile equidistant from the part surface. The locations of the cooling channels and the baffle tubes were automatically generated and input to the mold cooling CAE program, Moldflow MPI Cool. The objective function was the deviation of the mold surface temperature from a given design temperature. Design variables in the optimization were the depths and distances of the cooling channels and the baffle tubes. Optimization was carried out by PQRSM. To reduce the cost in the optimization, the same problem was optimized by the DOE and metamodeling techniques supplied by PIAnO, and the results were compared with the one by PQRSM. As the result, more uniform temperature distribution compared with the initial design was obtained, and a satisfactory solution could be made at a lower cost in the approximate optimization.