Advanced System-on-Package RF Front-ends for Emerging Wireless Communications ( Invited paper )

System-on-Package (SOP) is getting more attention in the RF area and is being applied to RF functional blocks and the front-end modules to achieve lower cost, improved performance, and increased design flexibility. In this paper, we present recent developments of RF modules based on the SOP concept. The SOP modules include power amplifier module with embedded harmonic suppression filter, VCO with embedded high-Q inductor, and compact RF-front-ends that were developed by utilizing the ceramic and organic based multi-layer packaging technologies, respectively. The examples in this paper indicate the feasibility of the SOP approach for solving RF issues, which cannot be solved easily with current conventional approaches.

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