Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics
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K. Suganuma | H. Uchida | T. Sugahara | J. Jiu | S. Nagao | Hui-wang Cui | K. Schroder
[1] Dong‐sheng Li,et al. Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging , 2013 .
[2] Qiong Fan,et al. Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging , 2013 .
[3] M. Ehrhardt,et al. Joining of molybdenum thin films with copper printed circuit board by laser micro-riveting , 2013 .
[4] Dong‐sheng Li,et al. High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package , 2013 .
[5] Jinghua Teng,et al. Reflective plasmonic color filters based on lithographically patterned silver nanorod arrays. , 2013, Nanoscale.
[6] K. Moon,et al. The conduction development mechanism of silicone-based electrically conductive adhesives , 2013 .
[7] Dong‐sheng Li,et al. Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives , 2013, Electronic Materials Letters.
[8] J. Gaier,et al. High-temperature multifunctional magnetoactive nickel graphene polyimide nanocomposites , 2013 .
[9] Yong-Won Song,et al. Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering. , 2013, ACS applied materials & interfaces.
[10] Liangzhu Feng,et al. Graphene oxide-silver nanocomposite as a highly effective antibacterial agent with species-specific mechanisms. , 2013, ACS applied materials & interfaces.
[11] Hui-wang Cui,et al. Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging , 2013 .
[12] X. Zhong,et al. Effective reinforcement of electrical conductivity and strength of carbon nanotube fibers by silver-paste-liquid infiltration processing. , 2013, Physical chemistry chemical physics : PCCP.
[13] Hyun-Jun Hwang,et al. In situ monitoring of a flash light sintering process using silver nano-ink for producing flexible electronics , 2013, Nanotechnology.
[14] Dong‐sheng Li,et al. Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives , 2013, Electronic Materials Letters.
[15] Dong‐sheng Li,et al. Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging , 2013 .
[16] Kenji Shinozaki,et al. Strongly adhesive and flexible transparent silver nanowire conductive films fabricated with a high-intensity pulsed light technique , 2012 .
[17] L. Shao,et al. Using of carbon nanotubes and nano carbon black for electrical conductivity adjustment of pressure-sensitive adhesives , 2012 .
[18] Ulrich S Schubert,et al. Roll‐to‐Roll Compatible Sintering of Inkjet Printed Features by Photonic and Microwave Exposure: From Non‐Conductive Ink to 40% Bulk Silver Conductivity in Less Than 15 Seconds , 2012, Advanced materials.
[19] H. Nishikawa,et al. Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications , 2012, Journal of Electronic Materials.
[20] Hiroshi Saito,et al. Drop-on-Demand Laser Sintering With Silver Nanoparticles for Electronics Packaging , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[21] Y. Liu,et al. Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives , 2012, Rare Metals.
[22] Y. Mai,et al. Thermal conductive and electrical properties of polyurethane/hyperbranched poly(urea-urethane)-grafted multi-walled carbon nanotube composites , 2011 .
[23] D. Chaussy,et al. Industrial pressure sensitive adhesives suitable for physicochemical microencapsulation , 2011 .
[24] H. T. Hahn,et al. Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light , 2011 .
[25] M. Nogi,et al. Printable and Stretchable Conductive Wirings Comprising Silver Flakes and Elastomers , 2011, IEEE Electron Device Letters.
[26] Limin Wu,et al. Preparation and characterization of phenol formaldehyde/Ag/graphite nanosheet composites , 2011 .
[27] Jongmin Kim,et al. Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs) , 2011, Microelectron. Reliab..
[28] Xinming Wu,et al. Electrically conductive adhesive based on acrylate resin filled with silver plating graphite nanoshe , 2011 .
[29] Li-qing Bian,et al. Study of the visible light curing of vinyl ester resins using in situ Raman spectroscopy , 2011 .
[30] Z. X. Zhang,et al. The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires , 2011 .
[31] Wentao Xu,et al. Organic field-effect transistors with cross-linked high-k cyanoethylated pullulan polymer as a gate insulator , 2010 .
[32] Ulrich S Schubert,et al. Microwave Flash Sintering of Inkjet‐Printed Silver Tracks on Polymer Substrates , 2009, Advanced materials.
[33] H. Thomas Hahn,et al. Intense pulsed light sintering of copper nanoink for printed electronics , 2009 .
[34] Masahiro Inoue,et al. Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles , 2009 .
[35] J. Lee,et al. Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards , 2008 .
[36] Tomi Mattila,et al. Electrical sintering of nanoparticle structures , 2008, Nanotechnology.
[37] W. Yeh,et al. In situ fabrication of photocurable conductive adhesives with silver nano-particles in the absence of capping agent , 2007 .
[38] Yan Ming Wang,et al. Study on the electrical and mechanical properties of phenol formaldehyde resin/graphite composite for bipolar plate , 2007 .
[39] Fatang Tan,et al. Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives , 2006 .
[40] Yi Li,et al. Electronics Without Lead , 2005, Science.
[41] K. Moon,et al. A novel approach to stabilize contact resistance of electrically conductive adhesives on lead-free alloy surfaces , 2004 .
[42] R. Bogner,et al. Techniques to monitor the UV curing of potential solvent-free film-coating polymers , 1995 .
[43] Qiong Fan,et al. Reliability of flexible electrically conductive adhesives , 2013 .
[44] T. Agag,et al. Use of allyl-functional benzoxazine monomers as replacement for styrene in vinyl ester resins , 2013 .
[45] R. Liska,et al. Thiol‐ene photopolymerization for efficient curing of vinyl esters , 2013 .
[46] Sung-Hyeon Park,et al. Two-step flash light sintering process for crack-free inkjet-printed Ag films , 2012 .
[47] Xiaojiang Yang,et al. Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin , 2011, Journal of Materials Science: Materials in Electronics.
[48] A. Alastalo,et al. Printed WORM Memory on a Flexible Substrate Based on Rapid Electrical Sintering of Nanoparticles , 2011, IEEE Transactions on Electron Devices.
[49] Daniel Lu,et al. Electrical Conductive Adhesives with Nanotechnologies , 2010 .