Multi-layer fully organic-based system on package (SOP) technology for RF applications

We present the development and characterization of multi-layer fully organic-based system-on-package (SOP) technology, referred to as the single level integrated module (SLIM), for RF applications. A multi-layer transceiver architecture and a hybrid microstrip and coplanar waveguide interconnect scheme have been proposed and developed to allow high density interconnects. Coplanar waveguide transmission line test structures have been fabricated on the multi-layer material system and demonstrate an insertion loss of 1.4 dB/in at 13 GHz and a return loss better than 15 dB at 13 GHz.