Placement Strategies for 2.5D FPGA Fabric Architectures
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[1] John H. Lau,et al. Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package , 2009, 2009 59th Electronic Components and Technology Conference.
[2] R. Chaware,et al. Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.
[3] Shankar Krishnamoorthy,et al. Estimating routing congestion using probabilistic analysis , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[4] Vaughn Betz,et al. Multiple Dice Working as One: CAD Flows and Routing Architectures for Silicon Interposer FPGAs , 2016, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[5] Jarrod A. Roy,et al. Capo: Congestion-Driven Placement for Standard-cell and RTL Netlists with Incremental Capability , 2007, Modern Circuit Placement.
[6] K. Saban. Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity , Bandwidth , and Power Efficiency , 2009 .
[7] Patrick Dorsey. Xilinx Stacked Silicon Interconnect Technology Delivers Breakthrough FPGA Capacity, Bandwidth, and Power Efficiency , 2010 .
[8] E. J. Vardaman,et al. Developments in 2.5D: The role of silicon interposers , 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
[9] Kia Bazargan,et al. Multi-objective circuit partitioning for cutsize and path-based delay minimization , 2002, IEEE/ACM International Conference on Computer Aided Design, 2002. ICCAD 2002..
[10] Jan M. Van Campenhout,et al. On synthetic benchmark generation methods , 2000, 2000 IEEE International Symposium on Circuits and Systems. Emerging Technologies for the 21st Century. Proceedings (IEEE Cat No.00CH36353).