칩 간 통신을 위한 파워 분배망에서의 칩과 패키지의 통합설계

This paper describes analysis for impedance of PDN(Power Distribution Network) including core and I/O circuit modeling. Noise is a important problem to inter-chip communication. To decrease noise, we use decoupling capacitor for lower impedance. The decoupling capacitor is related with location of decoupling capacitor on board. We calculated decoupling capacitor's values considering decoupling capacitor's location. As a result, Impedance were lower than target impedance and Noise decrease about 76% than no decoupling capacitors.