Diamond bit cutting for processing high topography wafers

In this paper we report the results of diamond bit cutting on metals, such as Cu and Sn, polymers, temporary glue and polyimide. Diamond bit cutting is an attractive, fast and economically viable option when processing on high topography wafers is required, or when smooth surface finish is required. Diamond bit cutting can planarize the surface of the high topography features on which conventional IC processing steps can be performed with ease.

[1]  W. Ruythooren,et al.  Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies , 2009, 2009 59th Electronic Components and Technology Conference.

[2]  R. Labie,et al.  Cu-Cu Bonding Alternative to Solder based Micro-Bumping , 2007, 2007 9th Electronics Packaging Technology Conference.

[3]  E. Beyne,et al.  3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies , 2007, 2007 9th Electronics Packaging Technology Conference.