Enrichment of alloying elements beneath anodic oxides: investigation of Ta-1.5 at.% Cu alloy
暂无分享,去创建一个
K. Shimizu | G. Thompson | H. Habazaki | P. Skeldon | S. Mato | D. Masheder
[1] K. Shimizu,et al. GDOES depth profiling analysis of a thin surface film on aluminium , 1999 .
[2] Robert Sinclair,et al. Solid-state amorphization at tetragonal-Ta/Cu interfaces , 1999 .
[3] K. Shimizu,et al. Incorporation of Tungsten Species into the Anodic Film on Zr‐2.7 Atom Percent W Alloy , 1997 .
[4] K. Shimizu,et al. Evidence of oxygen bubbles formed within anodic films on aluminium-copper alloys , 1997 .
[5] K. Shimizu,et al. Copper enrichment in Al-Cu alloys due to electropolishing and anodic oxidation , 1997 .
[6] J. Pringle. Further Observations on the Marker Behavior of Noble Gases during the Anodic Oxidation of Tantalum , 1974 .
[7] F. Brown,et al. The Use of Rutherford Backscattering to Study the Behavior of Ion‐Implanted Atoms During Anodic Oxidation of Aluminum: Ar, Kr, Xe, K, Rb, Cs, Cl, Br, and l , 1973 .
[8] J. Pringle. Transport Numbers of Metal and Oxygen during the Anodic Oxidation of Tantalum , 1973 .
[9] K. Shimizu,et al. Effects of Alloying Elements in Anodizing of Aluminium , 1997 .
[10] J. P. Pemsler,et al. Impurity Distributions in Anodic Films on Tantalum , 1972 .