Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

[1]  F. Fournel,et al.  Hydrophilic low-temperature direct wafer bonding , 2008 .

[2]  L. Di Cioccio,et al.  Enabling technologies for 3D integration: From packaging miniaturization to advanced stacked ICs , 2008, 2008 IEEE International Electron Devices Meeting.

[3]  D. Malta,et al.  Bonding for 3-D Integration of Heterogeneous Technologies and Materials , 2008, ECS Transactions.

[4]  Pierric Gueguen,et al.  Copper direct bonding for 3D integration , 2008, 2008 International Interconnect Technology Conference.

[5]  Eric Beyne,et al.  Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking , 2008, 2008 International Interconnect Technology Conference.

[6]  Zhihong Huang,et al.  Electromigration of Cu-Sn-Cu micropads in 3D interconnect , 2008, 2008 58th Electronic Components and Technology Conference.

[7]  Kevin T. Turner,et al.  Mixed-mode interface toughness of wafer-level Cu–Cu bonds using asymmetric chevron test , 2008 .

[8]  S. Spearing,et al.  Accurate characterization of wafer bond toughness with the double cantilever specimen , 2008 .

[9]  M. Reiche,et al.  Wafer bonding involving strain-relaxed SiGe , 2005 .

[10]  T. Itoh,et al.  Electrical Performance and Reliablity of Fine-Pitch Cu Bumpless Interconnect , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[11]  Fritz J. Kub,et al.  Improved Low-Temperature Si ­ Si Hydrophilic Wafer Bonding , 2003 .

[12]  Stefan Bengtsson,et al.  Room Temperature Wafer Bonding Using Oxygen Plasma Treatment in Reactive Ion Etchers With and Without Inductively Coupled Plasma , 2003 .

[13]  Bernard Aspar,et al.  High-energy x-ray reflectivity of buried interfaces created by wafer bonding , 2001 .

[14]  U. Gösele,et al.  SemiConductor Wafer Bonding: Science and Technology , 1998 .

[15]  D. Hamann,et al.  Physics and chemistry of silicon wafer bonding investigated by infrared absorption spectroscopy , 1996 .

[16]  M. Bruel.  Silicon on insulator material technology , 1995 .

[17]  U. Gösele,et al.  Semiconductor wafer bonding: recent developments , 1994 .

[18]  W. Maszara,et al.  Bonding of silicon wafers for silicon‐on‐insulator , 1988 .

[19]  J. Lasky.  Wafer bonding for silicon‐on‐insulator technologies , 1986 .

[20]  Chuan Seng Tan,et al.  Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration , 2005 .

[21]  Stefan Bengtsson,et al.  Semiconductor Wafer Bonding: Science Technology, and Applications VI , 2001 .