论文信息 - Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

Analysis of 60 GHz flip-chipped package using EM tool-based time-domain reflectometry

A systematic approach based on `package-peeling' together with time-domain reflectometry (TDR) for package characterization using an EM-tool is presented. The said methodology is applied to investigate and address the possible causes of transmission losses for a measured 60 GHz flip-chipped package, embedding a power amplifier (PA) and a balanced-fed-aperture-coupled-patch (BFACP) antenna with an anisotropic conductive adhesive (ACA) flip-chip interconnection scheme. The proposed technique caters for TDR measurement system limitations and aids in investigation and improving the performance of the millimeter-wave flip-chipped packages.

M. H. A. J. Herben | M. I. Kazim

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