Impact of MOSFET gate oxide breakdown on digital circuit operation and reliability

The influence of FET gate oxide breakdown on the performance of a ring oscillator circuit is studied using statistical tools, emission microscopy, and circuit analysis. It is demonstrated that many hard breakdowns can occur in this circuit without affecting its overall function. Time-to-breakdown data measured on individual FETs are shown to scale correctly to circuit level. SPICE simulations of the ring oscillator with the affected FET represented by an equivalent circuit confirm the measured influence of the breakdown on the circuit's frequency, the stand-by and the operating currents. It is concluded that if maintaining a digital circuit's logical functionality is the sufficient reliability criterion, a nonzero probability exists that the circuit will remain functional beyond the first gate oxide breakdown. Consequently, relaxation of the present reliability criterion in certain cases might be possible.

[1]  W. Weber,et al.  The Mechanisms of Hot-Carrier Degradation , 1992 .

[2]  K. Okada,et al.  A concept of gate oxide lifetime limited by "B-mode" stress induced leakage currents in direct tunneling regime , 1999, 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325).

[3]  Stephan A. Cohen,et al.  Gate oxide breakdown under Current Limited Constant Voltage Stress , 2000, 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104).

[4]  J. Bude,et al.  Gate oxide reliability projection to the sub-2 nm regime , 2000 .

[5]  M. Alam,et al.  The statistical distribution of percolation resistance as a probe into the mechanics of ultra-thin oxide breakdown , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

[6]  B. Kaczer,et al.  Quantitative yield and reliability projection from antenna test results-a case study , 2000, 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104).

[7]  R. Degraeve,et al.  Relation between breakdown mode and breakdown location in short channel NMOSFETs and its impact on reliability specifications , 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

[8]  A. De Keersgieter,et al.  Consistent model for short-channel nMOSFET post-hard-breakdown characteristics , 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).

[9]  J. Stathis Physical and predictive models of ultra thin oxide reliability in CMOS devices and circuits , 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

[10]  R. Degraeve,et al.  Explanation of nMOSFET substrate current after hard gate oxide breakdown , 2001 .

[11]  D. Frank,et al.  Transistor-limited constant voltage stress of gate dielectrics , 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).