The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods

For pt.I see ibid., vol.20, no.4, pp.384-91 (1997). The purpose of the second part of the DELPHI survey paper is twofold. First, to describe the experimental methods that have been developed to validate the numerical models generated to characterize a certain electronic part in full detail and second, to highlight the various approaches that were studied to generate compact models from the detailed models. It can be concluded that the results of the experimental as well as the numerical methods which are highlighted in this part are characterized by a high accuracy, typically of the order of 95% or better.

[1]  C. Lasance,et al.  NATURAL CONVECTION EXPERIMENTS WITH CUBOIDS AND CYLINDERS OF EQUAL AREA , 1997 .

[2]  H. I. Rosten,et al.  Thermal modelling of the Pentium processor package , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[3]  V.H. Adams,et al.  Issues in validating package compact thermal models for natural convection cooled electronic systems , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[4]  H. Vinke,et al.  Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[5]  G. B. Kromann,et al.  The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[6]  Clemens J. M. Lasance,et al.  A transient method for the accurate measurement of interface thermal resistances , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[7]  H. I. Rosten.  DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[8]  H. Vinke,et al.  A novel approach for the thermal characterization of electronic parts , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[9]  Harvey I Rosten,et al.  DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment , 1995 .

[10]  J.D. Parry,et al.  Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[11]  J. P. le Jannou,et al.  Representation of thermal behavior of electronic components for the creation of a databank , 1991 .

[12]  H. Vinke,et al.  Compact models for accurate thermal characterization of electronic parts , 1997 .

[13]  A. Bar-Cohen,et al.  Theta /sub JC/ characterization of chip packages-justification, limitations, and future , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[14]  M. Mahalingam,et al.  Surface mount plastic packages-an assessment of their thermal performance , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[15]  W. Temmerman,et al.  Experimental Validation Methods for Thermal Models , 1997 .

[16]  Kenneth Rodgers,et al.  Thermal resistance measurement protocols , 1998 .

[17]  H. Vinke,et al.  Thermal Characterization of Electronic Devices by Means of Improved Boundary Condition Independent Compact Models , 1997 .

[18]  Clemens J. M. Lasance.  Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[19]  J. Andrews,et al.  Thermal Characteristics of 16- and 40-Pin Plastic DIP's , 1981 .

[20]  H. I. Rosten.  Delphi — A Status Report on the Esprit Funded Project for the Creation and Validation of Thermal Models of Electronic Parts , 1997 .

[21]  E. Beyne,et al.  Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment , 1997 .

[22]  H. Vinke,et al.  Thermal characterization of electronic devices with boundary condition independent compact models , 1995 .