The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold

[1]  S. Mohanty,et al.  A review on epoxy-based electrically conductive adhesives , 2020 .

[2]  P. He,et al.  The mixture of silver nanowires and nanosilver-coated copper micronflakes for electrically conductive adhesives to achieve high electrical conductivity with low percolation threshold , 2020 .

[3]  Yanhong Tian,et al.  Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles , 2019, Nanomaterials.

[4]  Yang Cao,et al.  A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives , 2019, Journal of Materials Science: Materials in Electronics.

[5]  Qingshi Meng,et al.  Mechanical and electrical properties of graphene and carbon nanotube reinforced epoxy adhesives: Experimental and numerical analysis , 2019, Composites Part A: Applied Science and Manufacturing.

[6]  Liang Zhang,et al.  Structure and properties of Sn-Cu lead-free solders in electronics packaging , 2019, Science and technology of advanced materials.

[7]  S. J. Peighambardoust,et al.  Electrically conductive nanocomposite adhesives based on epoxy resin filled with silver coated nanocarbon black , 2018, Journal of Materials Science: Materials in Electronics.

[8]  K. Paik,et al.  Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers , 2018 .

[9]  Jun Zhang,et al.  Conductivity enhancement of polymer composites using high-temperature short-time treated silver fillers , 2017 .

[10]  M. Mariatti,et al.  Effects of Silver Microparticles and Nanoparticles on Thermal and Electrical Characteristics of Electrically Conductive Adhesives , 2017, Journal of Electronic Materials.

[11]  Yunping Li,et al.  Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder , 2016, Scientific Reports.

[12]  S. Pat,et al.  Optical and Surface Characteristics of Mg-Doped GaAs Nanocrystalline Thin Film Deposited by Thermionic Vacuum Arc Technique , 2016, Journal of Electronic Materials.

[13]  Lili Liu,et al.  Defects in Graphene: Generation, Healing, and Their Effects on the Properties of Graphene: A Review , 2015 .

[14]  Anming Hu,et al.  Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications , 2015, Journal of Materials Science: Materials in Electronics.

[15]  H. Bao,et al.  Research on electrical conductive adhesives filled with mixed filler , 2014 .

[16]  M. Mariatti,et al.  Effects of hybrid fillers based on micro- and nano-sized silver particles on the electrical performance of epoxy composites , 2013, Journal of Materials Science: Materials in Electronics.

[17]  Xu Chen,et al.  Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive , 2010 .

[18]  H. Nishikawa,et al.  Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives , 2010 .

[19]  Johann Nicolics,et al.  Electrically Conductive Adhesives , 2007 .

[20]  H. Hai,et al.  Developing process for coating copper particles with silver by electroless plating method , 2006 .

[21]  M. Ge,et al.  High conductivity of isotropic conductive adhesives filled with silver nanowires , 2006 .

[22]  Yi Li,et al.  Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications , 2006 .

[23]  Yung‐Sen Lin,et al.  Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications , 2004 .

[24]  Sampath Purushothaman,et al.  Development of conducting adhesive materials for microelectronic applications , 1999 .

[25]  D. Lu,et al.  High performance conductive adhesives , 1999 .

[26]  G. Janowski,et al.  A technique for sputter coating of ceramic reinforcement particles , 1997 .

[27]  Yicai Sun,et al.  Measurement of sheet resistance of cross microareas using a modified van der Pauw method , 1996 .

[28]  K. Gilleo,et al.  Assembly with Conductive Adhesives , 1995 .

[29]  K. Asakura,et al.  Structure of polymer-protected palladium/platinum bimetallic clusters at the oxidized state. Extended X-ray absorption fine structure analysis , 1992 .