반도체 패키지 외관 검사 시스템 개발

In this paper, new inspection method is proposed for the surfaces of lead frame and IC"s. Optimal optical system and the accurate algorithm for the surface inspection are needed in machine vision area. The proposed optical system is composed of rectangular oblique light illumination and coaxial light illumination for the higher contrast and the results shows the better performances through experiments. The markings of IC surface are inspected using the accurate proposed method using the partitioned correlation coefficient, and the result shows reduction of under kill ratio compared to the previous method.