A New Cell Topology for 4H-SiC Planar Power MOSFETs for High-Frequency Switching

A new cell topology named the dodecagonal (a polygon with twelve sides, short for Dod) cell is proposed to optimize the gate-to-drain capacitance (Cgd) and reduce the specific ON-resistance (Ron,sp) of 4H-SiC planar power MOSFETs. The Dod and the octagonal (Oct) cells are used in the layout design of the 650 V SiC MOSFETs in this work. The experimental results confirm that the Dod-cell MOSFET achieves a 2.2× lower Ron,sp, 2.1× smaller high-frequency figure of merit (HF-FOM), higher turn on/off dv/dt, and 29% less switching loss than the fabricated Oct-cell MOSFET. The results demonstrate that the Dod cell is an attractive candidate for high-frequency power applications.

[1]  A. Agarwal,et al.  Effects of JFET Region Design and Gate Oxide Thickness on the Static and Dynamic Performance of 650 V SiC Planar Power MOSFETs , 2022, Materials.

[2]  A. Shima,et al.  Impact of Cell Layout on On-state and Dynamic Characteristics of N-channel SiC IGBTs , 2022, 2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

[3]  A. Agarwal,et al.  JFET Region Design Trade-Offs of 650 V 4H-SiC Planar Power MOSFETs , 2021, Solid State Electronics Letters.

[4]  B. J. Baliga,et al.  Impact of Cell Topology on Characteristics of 600V 4H-SiC Planar MOSFETs , 2019, IEEE Electron Device Letters.

[5]  B. J. Baliga,et al.  The 1.2-kV 4H-SiC OCTFET: A New Cell Topology With Improved High-Frequency Figures-of-Merit , 2019, IEEE Electron Device Letters.

[6]  K. Tsuruta,et al.  Deep-P encapsulated 4H-SiC trench MOSFETs with ultra low RonQgd , 2018, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

[7]  Hamidreza Ghorbani,et al.  A Novel Active Gate Driver for Improving SiC MOSFET Switching Trajectory , 2017, IEEE Transactions on Industrial Electronics.

[8]  Bo Zhang,et al.  A SiC Power MOSFET Loss Model Suitable for High-Frequency Applications , 2017, IEEE Transactions on Industrial Electronics.

[9]  Hirofumi Akagi,et al.  Modeling of a silicon-carbide MOSFET with focus on internal stray capacitances and inductances, and its verification , 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).

[10]  B. Hull,et al.  High Switching Performance of 1700-V, 50-A SiC Power MOSFET Over Si IGBT/BiMOSFET for Advanced Power Conversion Applications , 2016, IEEE Transactions on Power Electronics.

[11]  T. Kimoto Material science and device physics in SiC technology for high-voltage power devices , 2015 .

[12]  B. J. Baliga,et al.  Power semiconductor device figure of merit for high-frequency applications , 1989, IEEE Electron Device Letters.

[13]  Aditi Agarwal,et al.  Assessment of Linear, Hexagonal, and Octagonal Cell Topologies for 650 V 4H-SiC Inversion-Channel Planar-Gate Power JBSFETs Fabricated With 27 nm Gate Oxide Thickness , 2021, IEEE Journal of the Electron Devices Society.

[14]  Junhong Zhang,et al.  Power Semiconductor Device Figure of Merit for High-Power-Density Converter Design Applications , 2008, IEEE Transactions on Electron Devices.