Haosu Luo

发表

Siu Wing Or, Wenning Di, Haosu Luo, 2010, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Haosu Luo, Wenning Di, Tingyu Deng, 2021, Applied Physics A.

T. Granzow, Haosu Luo, J. Daniels, 2019, Materials Research Letters.

Haosu Luo, Xiaobing Li, Zhang Zhang, 2018, Sensors and Actuators A: Physical.

D. Viehland, Jiefang Li, Haosu Luo, 2016, Scientific Reports.

S. Or, Xiangyong Zhao, Haosu Luo, 2012, The Review of scientific instruments.

Xiangyong Zhao, Haosu Luo, Yaoyao Zhang, 2011, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

S. Dong, Haosu Luo, Bo Ren, 2011, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Haosu Luo, Feifei Wang, W. Shi, 2010, The Review of scientific instruments.

S. Dong, Haosu Luo, Bo Ren, 2010, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Xiangyong Zhao, Haosu Luo, Yaoyao Zhang, 2010, Proceedings of the 2010 Symposium on Piezoelectricity, Acoustic Waves and Device Applications.

Qifa Zhou, Jiyan Dai, Dan Zhou, 2010, 2010 IEEE International Ultrasonics Symposium.

L. Luo, Haosu Luo, Feifei Wang, 2008 .

Xiangyong Zhao, Haosu Luo, Feifei Wang, 2007, The Review of scientific instruments.

Chongjun He, Xiangyong Zhao, Haosu Luo, 2006, 2006 Joint 31st International Conference on Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics.

Xiangyong Zhao, Haosu Luo, Wei Wang, 2015, 2015 IEEE International Ultrasonics Symposium (IUS).

Simon P. Ringer, Xiaozhou Liao, Haosu Luo, 2018 .

Y. Mai, Fei Li, S. Ringer, 2021, Nature Communications.

Xin-guang Xu, M. Jiang, Haosu Luo, 1997 .

Haosu Luo, Jie Jiao, Yaojin Wang, 2022, Applied Physics Letters.

Haosu Luo, Xuehua Zhang, W. Zhong, 2006 .

Haosu Luo, Xiangping Jiang, Zongyang Shen, 2019, Journal of the American Ceramic Society.

D. Viehland, Shuhao Wang, Haosu Luo, 2019, Advanced Electronic Materials.

Haosu Luo, Tingyu Deng, Ziyun Chen, 2022, Journal of Physics and Chemistry of Solids.

Xiangyong Zhao, Haosu Luo, Jianning Ding, 2018, Journal of Materials Science: Materials in Electronics.

Xiangyong Zhao, Haosu Luo, Feifei Wang, 2019, Journal of the American Ceramic Society.

Haosu Luo, C. Duan, Yaojin Wang, 2022, Journal of physics. Condensed matter : an Institute of Physics journal.

Gary P. Centers, D. F. Kimball, P. Mauskopf, 2021, Physical review letters.

E. Colla, M. Weissman, P. Gehring, 2007 .

Xiangyong Zhao, Haosu Luo, D. Sun, 2018, Journal of Materials Science: Materials in Electronics.

Xiangyong Zhao, Haosu Luo, Qihui Zhang, 2017, Journal of Materials Science: Materials in Electronics.

James M Rondinelli, Hongping Wu, Haosu Luo, 2011, Journal of the American Chemical Society.

Zhenxiang Cheng, Haosu Luo, W. Zhong, 1998 .

Haosu Luo, Haiqing Xu, Zhengqian Fu, 2019, Ceramics International.

Yiping Guo, D. Viehland, Binquan Wang, 2022, Science.

Xiangyong Zhao, Haosu Luo, D. Lin, 2009, Journal of physics. Condensed matter : an Institute of Physics journal.

Haosu Luo, J. Dai, K. S. Wong, 2007, International Symposium on Applications of Ferroelectrics.

Xi-qi Feng, Xiangyong Zhao, Haosu Luo, 2010, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

Haosu Luo, Z. Yin, Wei Luo, 1999, 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027).

Haosu Luo, J. Hlinka, I. Rafalovskyi, 2014 .

Haosu Luo, Chundong Xu, Bo Ren, 2014, Science China Technological Sciences.

Haosu Luo, Wenning Di, Ziyun Chen, 2020, Journal of Materials Science: Materials in Electronics.

Y. Mai, Fei Li, S. Ringer, 2022, ACS applied materials & interfaces.

Fei Li, S. Ringer, Xiaozhou Liao, 2020, Science Advances.

Zhou Zeng, Dong Wang, Bo Ren, 2016, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control.

Fang Wang, Haosu Luo, Renbing Sun, 2021, Journal of Advanced Dielectrics.

P. Gehring, Z. Ye, Haosu Luo, 2018, Nature Materials.

Yiping Guo, Haosu Luo, Jianwei Chen, 2023, ACS Applied Materials and Interfaces.

Haosu Luo, Chundong Xu, Bo Ren, 2014, Microsystem Technologies.